Asked by Rothana Martaa on Jun 22, 2024

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Thermal paste is used between which of the following components?

A) Heat sink and CPU
B) Heat sink and fan
C) CPU and motherboard
D) Motherboard and RAM

Thermal Paste

A thermally conductive compound applied between the CPU and its heat sink to enhance heat dissipation.

CPU

The Central Processing Unit, essential for a computer, executes most of the machine's processing activities.

  • Familiarize oneself with core methods for diagnosing hardware and connectivity complications.
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Alissia DegregoryJun 27, 2024
Final Answer :
A
Explanation :
Thermal paste is used between the heat sink and CPU to improve heat transfer efficiency by filling in any tiny gaps or irregularities between the two surfaces. Using thermal paste between the heat sink and fan or between the CPU and motherboard is unnecessary and may even impede heat transfer. And using thermal paste between the motherboard and RAM is not applicable as there is no direct contact between these components.